[nanoPost] Carbon nanostructures as microprocessor interconnects

Company Sweden

The company is devoted to develop, validate and utilize state of the art nanoscale technologies for the semiconductor industry by enhancing performance, enabling new functionalities and prolonging the lifetime of current and future manufacturing techniques.

With its patent pending technology platform, the company offers the semiconductor industry a unique solution on how to utilize nanostructures in their products.

As primarly application, the company is offering a carbon nanostructure based solution to increase the data transfer rates and to reduce the energy consumption in microprocessors.

The development in the semiconductor industry is governed by the ability to reduce the size of semiconductor components. As semiconductor components get smaller and faster, the copper interconnects transferring data in and out of the microprocessors are reaching their physical limits. At smaller scales, copper interconnects fail to comply with faster data transfer rates due to the increased current and temperature stress.

Out of many potential nanomaterials proposed to circumvent the problems with today's interconnect technology, carbon nanostructures have emerged as a promising candidate due to their unique electrical, optical, and mechanical properties.

Despite the extraordinary properties of carbon nanostructures, the semiconductor industry is facing challenges to integrate such materials into existing electronic circuits by making it CMOS-compatible, and to control the properties of carbon materials in terms of reproducibility and reliability.

Solution

The company is utilizing a patent pending technology platform that enables integration of carbon nanostructures into CMOS and post-CMOS technologies for enhancing performance of existing silicon circuits/microprocessors. The technology comprises a method for controlling the properties of grown nanostructures utilizing existing CMOS manufacturing process technology. As the first application area of The company's technology platform, The company is employing carbon nanostructures as microprocessor interconnects to bring the following added value:

Solutions for high performance and reliable interconnects
Compliance with existing manufacturing processes
Mass production compatibility
Enabling higher packing density on the chip
Controlled heat dissipation and cooling of modern CMOS devices and microprocessors
Low cost and high throughput