[nanoPost] Thin film coating and DLC coating and structuring

Company Germany

The company has many years of experience in the field of silicon micromachining, MEMS, SPM techniques, piezoresistive applications, SNOM and related fields are combined in the company.
The company R&D and their medium volume production has access to many standard MEMS and micromachining processes as well as standard CMOS processes like wet chemical etching, dry etching, deep silicon etching, high aspect ratio micromachining, oxidation, diffusion metallization, thin film coating and DLC coating and structuring.