[nanoPost] MEMS devices

Company Japan

STP (spin-coating film transfer and hot-pressing) technology has been developed by the company for new generation of MEMS devices. Especially the STP technology achieves simple sealing of deep cavities.

A spin-coated film on a base film is hot-pressed against a Si wafer in a vacuum.

Our STP machine, XP-1500M, achieves excellent hot pressing. The bubble might not be formed for processing under the vacuum. A uniform press force makes it possible that film adhere tightly to the whole wafer.

In addition, film bonding at low temperature is available. The STP machine is also used for a gap-filling planarization by changing the STP condition. Our compact clean oven can be used under both pressurization and depressurization.

In the STP process, this oven prevents organic films from swelling on curing by pressurization.
In addition, the company offers a wide variety of process service, such as deep Si etching, electroplating and wafer dicing.

Product / Technology
Film transfer pressing system, XP-1500M
Compact clean oven ( Pressurization and depressureization processable),PCO-063
Film conditioner, S-101
Process service for MEMS fabrication