[nanoPost] Nano gettering technllogy

Company USA

Patented proprietary technology does not require a high temperature metal oxide/metal reduction reaction step to activate the getter like older getter technologies. The gettering materials are deposited under high vacuum, so they are not oxidized in the act of forming the the product in the process of storing or transporting the material.

Once in use the temperature can be increased to enhance the gettering process. The reactive metal surface reacts with the gas atoms, locking them into the getter. These trapped atoms may diffuse into the getter, thereby renewing the metal surface, ready to adsorb more gas atoms.

Particles are a big problem with traditional Non Evaporable Getters (NEG) made using sintered, powder metallurgy techniques. Metal particles generated by the old style getters can lead to electrical shorts, friction wear, and other defects or problems.

Since the products are thin film based, and are not manufactured using powder metallurgy, the cleanliness of the product is far superior to NEGs. No random metal particles are produced by handling, activating or cutting the product.

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