Company USA
Main activities are the development of active material deposition to a substrate. The companies technologies maintain all the advantages of existing PVD, CVD, and other methods of deposition but exceed them in productivity, adhesion to the substrate, homogeneity, and other factors. Process efficiency of the film’s manufacturing using deposition methods is determined by 2 main factors: The core principle of the company’s technology is that material deposition can occur simultaneously with the material transfer, while the deposition rate increases. Increasing the material mass transfer is achieved by using high-pressure vapor flow (VDS technology), gas (vapor) flow with particles of initial material in liquid state (PVDS technology) and gas (vapor) flow with particles of initial material in solid state (HDS, HPVDS technology). This allows us to obtain ceramic or ceramic-metal coatings of determined porosity on metal or ceramic substrates. The rate of deposition is more than 100 µm /sec, which is 100-1000 times greater than existing vacuum PVD, CVD technologies, and 10 times greater compared with plasma and coating technologies of material deposition. Increasing of material deposition rate on the substrate and providing greater adhesion properties arise from vapor condensation in liquid state with it’s further solidification (VDS and PVDS technologies) or as the result of aerosol boiling of substrate surface layer (HDS, HPVSD technologies).
- Low prime cost and energy consumption - High efficiency of material deposition - High active layer adhesion to the substrate - Controlling porosity and structure dispersion of film’s structure constituents - Possibility of unlimited production scaling up
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