[nanoPost] Electrodes for energy storage devices

Company USA

- The companies technologies maintain all the advantages of existing PVD, CVD, and other methods of deposition but exceed them in productivity, adhesion to the substrate, homogeneity, and other factors.

- Process efficiency of the film’s manufacturing using deposition methods is determined by 2 main factors:
A.) Material quantity transfer from evaporator to the substrate and B.) Material quantity deposited to the substrate.

The core principle of the technology is that material deposition can occur simultaneously with the material transfer, while the deposition rate increases. Increasing the material mass transfer is achieved by using high-pressure vapor flow (VDS technology), gas (vapor) flow with particles of initial material in liquid state (PVDS technology) and gas (vapor) flow with particles of initial material in solid state (HDS, HPVDS technology). This allows us to obtain ceramic or ceramic-metal coatings of determined porosity on metal or ceramic substrates. The rate of deposition is more than 100 µm /sec, which is 100-1000 times greater than existing vacuum PVD, CVD technologies, and 10 times greater compared with plasma and coating technologies of material deposition.

- Increasing of material deposition rate on the substrate and providing greater adhesion properties arise from vapor condensation in liquid state with it’s further solidification (VDS and PVDS technologies) or as the result of aerosol boiling of substrate surface layer (HDS, HPVSD technologies).

- Predominantly using each of abovementioned methods determines by properties of initial material. For low-melting point ceramics and their eutectic compositions VDS method is most preferable. For high-melting point materials deposition PVDS technology is most preferable. HDS(HPVDS) method is ideal for deposition of materials with low thermal stability that are inclined to degradation under heating.

The goals of the company's technologies are:

- Low prime cost and energy consumption

- High efficiency of material deposition

- High active layer adhesion to the substrate

- Controlling porosity and structure dispersion of film’s structure constituents

- Possibility of unlimited production scaling up

Applications

- Electrodes for energy storage devices:Super thin (10-40 µm) electrodes based on LiMn2O4, LiCoO2, MnO2, C, Si with nanoparticles of active material integrated into current collector

- Thick electrodes for high-energy and high-power batteries. Active layer thickness on 20-50 µm current collector amounts to 50-500 µm

- Super thin (15-50 µm) single, rechargeable Li-ion ready for use batteries

Possible applications:

- Fuel cells

- Membranes

- Superconductive materials

- Super capacitors